Christoph Kiener
Christoph Kiener

Curious Electrical Engineer

03 Dec 2024

uDSP-Card: XCORE.AI Development Board for Portable Applications

This post introduces the uDSP-Card, a compact development board built on the XMOS XCORE.AI platform and tailored for portable and wearable applications. Despite its small footprint, it offers rich I/O and high-performance DSP capabilities at low power, making it ideal for audio, sensing, and real-time embedded tasks.

Note: This article is adapted from sections of my Master’s thesis on “Ultrasonic Hearing for Human Echolocation”.


Overview

The uDSP-Card was originally designed for a battery-powered, head-mounted system that interfaced with MEMS microphones, an 8-channel DAC, an ESP32-based wireless module, and a custom battery module. While tailored for this specific application, the board’s flexible I/O and modular architecture making it ideal for audio, sensing, and real-time embedded tasks.

The PCB of the uDSP-Card with headphone line out, USB connector, the XCORE.AI processor and the interconnect.
Figure 1: The PCB of the uDSP-Card with headphone line out, USB connector, the XCORE.AI processor and the interconnect.
System overview of the uDSP-Card.
Figure 2: System overview of the uDSP-Card.

Specification

The uDSP-Card is powered by the XMOS XU316-1024, a dual-core 800 MHz processor featuring 16 hardware threads and a dedicated vector unit for efficient real-time signal processing. Its architecture is derived from the XMOS reference design and development board XK-EVK-XU3161, adapted for compact, low-power, portable applications.

Key Features

  • Dimensions: 60 mm × 30 mm (6-layer PCB)
  • Processor: XMOS XU316-1024 (dual-core, 800 MHz, 16 threads)
  • RAM: 128 Mb LPDDR1
  • Flash: 32 Mb QSPI
  • microSD card slot
  • USB Interface: Device (power + audio/data)
  • Line Output: Stereo via ESS ES9033 DAC
  • Expansion Header: 44-pin interconnect
    • I²S (8ch)
    • I²C / SPI
    • PDM (8ch)
    • Power input
  • Onboard Sensors:
    • BMI323 IMU (accelerometer + gyro)
    • BME280 EMU (humidity, pressure, temperature)
Block diagram showing the system architecture of the uDSP-Card and its interfaces.
Figure 3: Block diagram showing the system architecture of the uDSP-Card and its interfaces.
3D rendering of the front side of the uDSP-Card.
Figure 4: 3D rendering of the front side of the uDSP-Card.
3D rendering of the back side of the uDSP-Card.
Figure 5: 3D rendering of the back side of the uDSP-Card.

Repository


References

Footnotes

  1. XMOS, "xcore.ai Explorer v2 BoardManual", Manual XM014531A, (2024)